ARALDITE AV5308

ARALDITE AV 5308 is the resin component of the ARALDITE AV 5308 / HARDENER HV 5309-2 two-component epoxy paste adhesive system. When combined with HV 5309-2, it forms a resilient adhesive that cures at room temperature for structural gap-filling applications. The mixed AV 5308 / HV 5309-2 system is thixotropic and non-sagging at thicknesses up to 10 mm, and is particularly suitable for bonding sheet molding compound and glass-reinforced plastic substrates.

Key features

• Up to 10 mm non-sag thickness: With HV 5309-2, the thixotropic system is non-sagging at thicknesses up to 10 mm.
• Room-temperature cure: The AV 5308 / HV 5309-2 two-component system cures at room temperature.
• SMC and GRP bonding: The complete system is particularly suitable for sheet molding compound and glass-reinforced plastic substrates.

Applications

Resin component in the AV 5308 / HV 5309-2 system for bonding SMC and glass-reinforced plastic substrates.