DOWSIL ME-1070

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

DOWSIL ME-1070

Main features

  • 30-Minute Cure at 150 deg C
  • 1000 psi Aluminum Lap Shear
  • 19 kV/mm Dielectric Strength

Product Description

DOWSIL ME-1070 Adhesive Black is a one-part, black, flowable, syringe-dispensable die attach adhesive for microelectronics packaging. The material combines self-priming adhesion with low ionic impurity levels and addition-cure chemistry. Typical viscosity is 20000 mPa*s, while the processing window remains greater than 24 hours to a 20% viscosity increase at 25 deg C. A 30-minute cure at 150 deg C develops a Shore A 72 material with typical tensile strength of 500 psi. Die attach performance includes 1000 psi lap shear on aluminum, with 19 kV/mm dielectric strength.

Key features

  • Self-Priming Die-Attach Adhesive: One-part flowable silicone is documented for microelectronics die attachment.
  • 30-Minute Cure at 150 deg C: The listed heat-cure condition applies to the one-part adhesive.
  • 1000 psi Aluminum Lap Shear: Typical cured tensile strength is 500 psi with 25% elongation.

Applications

Die attach adhesive for microelectronics packaging.

Product Family

DOWSIL ME-1070

Catalog Product

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
ColorColor
Black
Physical Properties
Thixotropic indexThixotropic index
2.9
ViscosityViscosity
20,000 mPa.s
Mechanical Properties
ElongationElongation
25 %
Electrical Properties
Dielectric StrengthDielectric Strength
19 kV/mm
Volume ResistivityVolume Resistivity
2.10E+15 Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

PropertyValueUnitMethod / condition
Viscosity20000mPa*sTypical
Time to 20% viscosity rise>24h25 deg C; typical
Heat cure30min150 deg C
Technical properties

After-processing / final-state properties

PropertyValueUnitMethod / condition
Durometer72Shore ACured; typical
Specific gravity1.2-Cured; 25 deg C; typical
Lap shear1000psiAluminum substrate; typical
Tensile strength500psiCured; typical
Elongation25%Cured; typical
Dielectric strength19kV/mmCured; typical
Volume resistivity2.1E15ohm*cmTypical

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