DOWSIL ME-6820
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Low-Ionic Wire-Bond Encapsulation
- 60-Minute Cure at 150 deg C
- 18 kV/mm Dielectric Strength
Product Description
DOWSIL ME-6820 Microelectronic Encapsulant is a one-part black silicone elastomer encapsulant for wire-bond package die encapsulation and protection of sensitive components. Its addition-cure chemistry generates no byproducts during cure and uses a 60-minute heat cure at 150 deg C. The material has low ionic impurity levels and low modulus of elasticity. Typical cured properties include Shore A 52 hardness, 565 psi tensile strength, 40% elongation, and 730 psi unprimed die-shear adhesion on aluminum. Electrical data include 18 kV/mm dielectric strength and 3.2E15 ohm*cm volume resistivity.
Key features
- About 6000 cP Encapsulant Viscosity: Typical as-supplied viscosity applies to the one-part encapsulant before heat cure.
- 60-Minute Cure at 150 deg C: The listed heat-cure condition applies to the one-part encapsulant.
- 18 kV/mm Dielectric Strength: Typical cured volume resistivity is about 3.2E15 ohm*cm.
Applications
Die encapsulation for wire-bond microelectronic packaging and protection of sensitive electronic structures.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Mechanical Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Viscosity | 6000 | cP | Typical |
| Heat cure time | 60 | min | 150 deg C; typical |
| Impurity, Na+ | 0.2 | ppm | Typical |
| Impurity, K+ | 0.6 | ppm | Typical |
| Impurity, Cl- | 1.4 | ppm | Typical |
After-processing / final-state properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Durometer | 52 | Shore A | Cured; typical |
| Tensile strength | 565 | psi | Cured; typical |
| Elongation | 40 | % | Cured; typical |
| Unprimed die-shear adhesion | 730 | psi | Aluminum substrate; typical |
| Dielectric strength | 18 | kV/mm | Typical |
| Volume resistivity | 3.2E15 | ohm*cm | Typical |
| Linear CTE | 225 | ppm/deg C | TMA; typical |
