DOWSIL TC-4015

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

DOWSIL TC-4015

Main features

  • 1.7 W/(m K) Thermal Conductivity
  • 4-Hour Working Time at 25 deg C
  • Screen-Printed or Dispensed Gap Filling

Product Description

DOWSIL TC-4015 Dispensable Thermal Pad is a two-part thermally conductive dispensable pad for filling thermal gaps in electronic assemblies. Parts A and B are white and blue pastes that mix to a material with a typical viscosity of 103,000 cP. The system has a typical 4-hour working time at 25 deg C and cures in 24 hours at 25 deg C, with heat acceleration to 10 minutes at 125 deg C. After cure, thermal conductivity is typically 1.7 W/(m K) and Shore 00 hardness is 50. It can be screen printed or dispensed into varied thicknesses and shapes for cooling PCB assemblies in LED, automotive, and consumer applications.

Key features

  • About 1.7 W/(m K) Thermal Conductivity: Typical thermal-conductivity value applies to the cured dispensable pad.
  • About 4-Hour Pot Life: Typical pot life applies to the mixed two-part material before cure.
  • 24-Hour Cure at 25 deg C: Room-temperature cure can be accelerated with heat.

Applications

Cooling PCB assemblies in LED lamps and luminaires; automotive electronics; consumer electronics.

Product Family

DOWSIL TC-4015

Catalog Product

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Component SystemComponent System
Two Part (A/B)
Pot LifePot Life
4 hours
Specific GravitySpecific Gravity
2.6
Mechanical Properties
ElongationElongation
260 %
Thermal Properties
Thermal ConductivityThermal Conductivity
1.7 W/m.K
Electrical Properties
Dielectric StrengthDielectric Strength
18 kV/mm
Volume ResistivityVolume Resistivity
5.18E+12 Ohms⋅cm

Additional Information

Technical properties

As-supplied component properties

PropertyValueUnitMethod / condition
Viscosity, Part A104,000cPTypical
Viscosity, Part B124,000cPTypical
Viscosity, mixed103,000cPTypical
Technical properties

Cured thermal pad properties

PropertyValueUnitMethod / condition
Specific gravity2.6-Cured; typical
Hardness50Shore 00Cured; typical
Thermal conductivity1.7W/(m K)Typical
Dielectric strength18kV/mmTypical
Volume resistivity5.18E12ohm*cmTypical

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