LOCTITE 3876
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Primer-Free Room-Temperature Cure
- Fast 3 to 5 Minute Fixture
- Structural Thermal Heat-Sink Bonding
Product Description
LOCTITE 3876 is a two-component, room-temperature-curing acrylate adhesive for thermally coupling and structurally bonding heat sinks to heat-dissipating electronic components. Pale-yellow Part A and pale-blue Part B cure when they contact, without primer or heat. The bead-on-bead system contains 175 um spacer beads for controlled bondline thickness, reaches fixture in 3 to 5 minutes at 23 deg C, and develops 1.76 W/(m K) thermal conductivity after cure. Applications include transistors, rectifiers, power devices, memory chips, chipsets, and graphics processors.
Key features
- Primer-Free Contact Cure: Part A and Part B cure on contact without primer or heat.
- Fast 3 to 5 Minute Fixture: Fixture time is 3 to 5 minutes at 23 deg C.
- Structural Thermal Attachment: Cured thermal conductivity is 1.76 W/(m K) with structural bonding.
Applications
Applications include attaching transistors, rectifiers, power devices, memory devices, chipsets, and graphics processors to heat sinks.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Other Properties
Additional Information
As-Supplied Properties
Part A and Part B properties are shown separately.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Part A appearance | Pale yellow | - | As supplied |
| Part B appearance | Pale blue | - | As supplied |
| Part A specific gravity | 1.7 | - | As supplied |
| Part B specific gravity | 1.7 | - | As supplied |
| Part A viscosity | 65,000 | mPa s | 2.5 rpm |
| Part A viscosity | 32,000 | mPa s | 20 rpm |
| Part B viscosity | 190,000 | mPa s | 2.5 rpm |
| Part B viscosity | 90,000 | mPa s | 20 rpm |
Final-State Properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Coefficient of thermal expansion, alpha 1 | 54 | ppm/deg C | Cured material |
| Coefficient of thermal expansion, alpha 2 | 141 | ppm/deg C | Cured material |
| Glass transition temperature | 28 | deg C | Cured material |
| Thermal conductivity | 1.76 | W/(m K) | ASTM D 5470 |
| Tensile shear strength | 16 | N/mm^2 | Grit-blasted steel |
| Tensile shear strength | 13 | N/mm^2 | Aluminum |
